This work studies the feasibility of a new implementation of CMOS monolithic active pixel sensors (MAPS) for applications to charged particle tracking. As compared to standard three MOSFET MAPS, where the charge signal is readout by a source follower, the proposed front-end scheme relies upon a charge sensitive amplifier (CSA), embedded in the elementary pixel cell, to perform charge-to-voltage conversion. The area required for the integration of the front-end electronics is mostly provided by the collecting electrode, which consists of a deep n-type diffusion, available as a shielding frame for n-channel devices in deep submicron, triple well CMOS technologies. Based on the above concept, a chip, which includes several test structures differing in the sensitive element area, has been fabricated in a 0.13 µm CMOS process. In this paper, the criteria underlying the design of the pixel level analog processor will be presented, together with some preliminary experimental results demonstrating the feasibility of the proposed approach.
(2006). Monolithic pixel detectors in a 0.13 µm CMOS technology with sensor level continuous time charge amplification and shaping [journal article - articolo]. In NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. Retrieved from http://hdl.handle.net/10446/20136
Monolithic pixel detectors in a 0.13 µm CMOS technology with sensor level continuous time charge amplification and shaping
Manghisoni, Massimo;Re, Valerio;Traversi, Gianluca;
2006-01-01
Abstract
This work studies the feasibility of a new implementation of CMOS monolithic active pixel sensors (MAPS) for applications to charged particle tracking. As compared to standard three MOSFET MAPS, where the charge signal is readout by a source follower, the proposed front-end scheme relies upon a charge sensitive amplifier (CSA), embedded in the elementary pixel cell, to perform charge-to-voltage conversion. The area required for the integration of the front-end electronics is mostly provided by the collecting electrode, which consists of a deep n-type diffusion, available as a shielding frame for n-channel devices in deep submicron, triple well CMOS technologies. Based on the above concept, a chip, which includes several test structures differing in the sensitive element area, has been fabricated in a 0.13 µm CMOS process. In this paper, the criteria underlying the design of the pixel level analog processor will be presented, together with some preliminary experimental results demonstrating the feasibility of the proposed approach.File | Dimensione del file | Formato | |
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