The potential of 3D integration of sensors and readout electronics is being explored in view of the demanding requirements of the innermost layer of the SuperB Silicon Vertex Tracker. This paper reviews the 3D designs that are targeting SuperB, which include CMOS active pixel sensors and front-end chips for fully-depleted, high-resistivity pixel sensors.
(2012). Advanced Pixel Sensors and Readout Electronics Based on 3D Integration for the SuperB Silicon Vertex Tracker [conference presentation - intervento a convegno]. In PHYSICS PROCEDIA. Retrieved from http://hdl.handle.net/10446/27821
Advanced Pixel Sensors and Readout Electronics Based on 3D Integration for the SuperB Silicon Vertex Tracker
RE, Valerio
2012-01-01
Abstract
The potential of 3D integration of sensors and readout electronics is being explored in view of the demanding requirements of the innermost layer of the SuperB Silicon Vertex Tracker. This paper reviews the 3D designs that are targeting SuperB, which include CMOS active pixel sensors and front-end chips for fully-depleted, high-resistivity pixel sensors.File allegato/i alla scheda:
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