Modelling of heating and evaporation of multi-component liquid films: recent developments

In this extended abstract, we will summarise recent results of the development on a simplified model that captures the key features of the processes in heated and evaporating liquid film and the validation of the results of this modelling. The main ideas of the model, described in this abstract, are based on the model of multi-component film heating/cooling and evaporation, described in [6, 7]. In that model, the analytical solutions to the one-dimensional heat transfer and component diffusion equations were used at each time step of the numerical code (analytical-numerical model). Some important limitations of the latter model, however, restricted its applicability with regard to many practically important engineering problems, including spray cooling. These were the assumption of a fixed wall temperature (Dirichlet boundary condition) and the absence of supply and removal of liquid from the film. These restrictions are removed in the new developments of the model briefly described below.