This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully depleted Silicon-On-Insulator (SOI) CMOS technology. In the SOI technology, a thin layer of integrated electronics is insulated from a (high-resistivity) silicon substrate by a buried oxide. Vias etched through the oxide allow to contact the substrate from the electronics layer, so that pixel implants can be created and a reverse bias can be applied. The prototype chip, manufactured in OKI 0.15muM SOI process, features both analog and digital pixels on a 10muM pitch. Results of tests performed with an infrared laser and 1.35 GeV electrons and a first assessment of the effect of ionising and non-ionising doses are discussed.
(2009). Monolithic pixel sensors in deep-submicron SOI technology with analog and digital pixels [journal article - articolo]. In NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. Retrieved from http://hdl.handle.net/10446/187096
Monolithic pixel sensors in deep-submicron SOI technology with analog and digital pixels
Mattiazzo, Serena;
2009-01-01
Abstract
This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully depleted Silicon-On-Insulator (SOI) CMOS technology. In the SOI technology, a thin layer of integrated electronics is insulated from a (high-resistivity) silicon substrate by a buried oxide. Vias etched through the oxide allow to contact the substrate from the electronics layer, so that pixel implants can be created and a reverse bias can be applied. The prototype chip, manufactured in OKI 0.15muM SOI process, features both analog and digital pixels on a 10muM pitch. Results of tests performed with an infrared laser and 1.35 GeV electrons and a first assessment of the effect of ionising and non-ionising doses are discussed.File | Dimensione del file | Formato | |
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