GAIONI, Luigi
 Distribuzione geografica
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Continente #
EU - Europa 29.157
NA - Nord America 13.410
AS - Asia 7.105
SA - Sud America 607
AF - Africa 285
Continente sconosciuto - Info sul continente non disponibili 18
OC - Oceania 16
Totale 50.598
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Nazione #
US - Stati Uniti d'America 12.976
GB - Regno Unito 11.295
IE - Irlanda 5.044
RU - Federazione Russa 3.199
CN - Cina 2.863
PL - Polonia 2.462
SG - Singapore 2.422
IT - Italia 2.036
DE - Germania 1.221
FR - Francia 1.181
NL - Olanda 926
SE - Svezia 818
VN - Vietnam 759
BR - Brasile 434
UA - Ucraina 369
CA - Canada 350
ZA - Sudafrica 201
FI - Finlandia 195
IN - India 171
HK - Hong Kong 153
AT - Austria 149
EU - Europa 127
KR - Corea 116
TR - Turchia 108
BD - Bangladesh 75
JP - Giappone 72
ID - Indonesia 71
IQ - Iraq 64
AR - Argentina 62
ES - Italia 52
MX - Messico 47
BE - Belgio 38
LT - Lituania 38
PK - Pakistan 34
CO - Colombia 31
MY - Malesia 31
CZ - Repubblica Ceca 28
CH - Svizzera 25
EC - Ecuador 21
SA - Arabia Saudita 19
PH - Filippine 18
VE - Venezuela 18
RO - Romania 17
BG - Bulgaria 16
CL - Cile 16
TN - Tunisia 16
UZ - Uzbekistan 15
AU - Australia 13
MA - Marocco 13
PY - Paraguay 13
LB - Libano 12
TW - Taiwan 12
GR - Grecia 11
JO - Giordania 11
IR - Iran 9
KE - Kenya 9
AE - Emirati Arabi Uniti 8
AZ - Azerbaigian 8
JM - Giamaica 8
KZ - Kazakistan 8
TH - Thailandia 8
EG - Egitto 7
IL - Israele 7
PE - Perù 7
DK - Danimarca 6
ET - Etiopia 6
CR - Costa Rica 5
LV - Lettonia 5
NP - Nepal 5
PS - Palestinian Territory 5
SC - Seychelles 5
BH - Bahrain 4
DO - Repubblica Dominicana 4
DZ - Algeria 4
HN - Honduras 4
PA - Panama 4
AO - Angola 3
BA - Bosnia-Erzegovina 3
BY - Bielorussia 3
GT - Guatemala 3
HU - Ungheria 3
MN - Mongolia 3
OM - Oman 3
PT - Portogallo 3
SN - Senegal 3
AL - Albania 2
AM - Armenia 2
BO - Bolivia 2
CW - ???statistics.table.value.countryCode.CW??? 2
CY - Cipro 2
GA - Gabon 2
HR - Croazia 2
KG - Kirghizistan 2
LA - Repubblica Popolare Democratica del Laos 2
MD - Moldavia 2
MT - Malta 2
MU - Mauritius 2
MZ - Mozambico 2
NG - Nigeria 2
NI - Nicaragua 2
Totale 50.677
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Città #
Southend 10.810
Dublin 5.017
Warsaw 2.405
Ashburn 1.393
Jacksonville 1.101
Singapore 1.087
Moscow 1.042
San Jose 938
Chandler 690
Woodbridge 463
Wilmington 457
Hefei 455
Ann Arbor 448
Princeton 429
Fairfield 406
Nanjing 387
Mountain View 384
Beijing 380
Dearborn 312
Dong Ket 298
Dalmine 290
Toronto 275
Boardman 260
Houston 249
Milan 227
Bergamo 205
Los Angeles 205
Sunnyvale 198
Seattle 194
The Dalles 191
Shanghai 186
Johannesburg 184
Rancio Valcuvia 163
Atlanta 160
Nanchang 160
Cambridge 158
Lauterbourg 156
Ho Chi Minh City 154
Altamura 143
New York 143
Andover 140
Hong Kong 137
San Mateo 135
Vienna 129
Hanoi 120
Washington 116
Santa Clara 98
Buffalo 95
London 94
Redwood City 83
Zhengzhou 76
Tianjin 73
Helsinki 68
Frankfurt am Main 67
Chicago 63
Kunming 61
São Paulo 58
Tokyo 57
Ogden 56
Orem 56
Shenyang 55
Berlin 54
Council Bluffs 53
Guangzhou 50
Kiez 50
Hebei 49
Jakarta 49
Munich 49
Pavia 48
Redondo Beach 47
Amsterdam 46
Dallas 45
Nuremberg 44
Fremont 43
Nürnberg 40
Jiaxing 38
Brussels 35
Hangzhou 35
Montreal 34
Kocaeli 33
Changsha 31
Brooklyn 30
Lappeenranta 30
Norwalk 30
Rome 30
Seoul 29
Jinan 28
Denver 25
Needham Heights 25
Phoenix 25
San Diego 24
Chennai 23
Pisa 23
Da Nang 22
Istanbul 22
Baghdad 21
Kuala Lumpur 21
Shenzhen 21
Verdellino 21
Changchun 20
Totale 35.983
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Nome #
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 829
Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC 701
65 nm Technology for HEP: Status and Perspective 672
A prototype of pixel readout ASIC in 65 nm CMOS technology for extreme hit rate detectors at HL-LHC 628
P-Type Silicon Strip Sensors for the new CMS Tracker at HL-LHC 602
The SuperB Silicon Vertex Tracker 576
A 65 nm CMOS Front-End Chip for High Density Readout of Pixel Sensors 549
3D DNW MAPS for High Resolution, Highly Efficient, Sparse Readout CMOS Detectors 520
Results from CHIPIX-FE0, a small-scale prototype of a new generation pixel readout ASIC in 65 nm CMOS for HL-LHC 519
A 3D deep n-well CMOS MAPS for the ILC vertex detector 501
Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade 487
Test beam demonstration of silicon microstrip modules with transverse momentum discrimination for the future CMS tracking detector 486
2D and 3D CMOS MAPS with high performance pixel-level signal processing 483
Precision measurement of the structure of the CMS inner tracking system using nuclear interactions 481
Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications 475
Alignment of the CMS tracker with LHC and cosmic ray data 473
Perspectives of 65nm CMOS technologies for high performance front-end electronics 472
Design and test of a 65nm CMOS front-end with zero dead time for next generation pixel detectors 452
A 65-nm CMOS Prototype Chip With Monolithic Pixel Sensors and Fast Front-End Electronics 446
Assessment of a low-power 65 nm CMOS technology for analog front-end design 445
Beam test results for the SuperB-SVT thin striplet detector 444
Vertically integrated deep N-well CMOS MAPS with sparsification and time stamping capabilities for thin charged particle trackers 437
Description and performance of track and primary-vertex reconstruction with the CMS tracker 434
The front-end chip of the SuperB SVT detector 433
The SuperB silicon vertex tracker 430
Vertical integration approach to the readout of pixel detectors for vertexing applications 427
Design of bandgap reference circuits in a 65 nm CMOS technology for HL-LHC applications 425
Radiation tolerance of devices and circuits in a 3D technology based on the vertical integration of two 130-nm CMOS layers 425
Forecasting noise and radiation hardness of CMOS front-end electronics beyond the 100 nm frontier 425
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 422
Comprehensive study of total ionizing dose damage mechanisms and their effects on noise sources in a 90 nm CMOS technology 412
Mechanisms of Noise Degradation in Low Power 65 nm CMOS Transistors Exposed to Ionizing Radiation 406
Fast Analog Front-end for the Readout of the SuperB SVT Inner Layers 400
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 399
Vertically integrated monolithic pixel sensors for charged particle tracking and biomedical imaging 399
Thin pixel development for the superB silicon vertex tracker 382
Investigating degradation mechanisms in 130nm and 90nm commercial CMOS technologies exposed to up to 100 Mrad ionizing radiation dose 376
Noise behavior of a 180 nm CMOS SOI technology for detector front-end electronics 372
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 363
Analog front-end for pixel sensors in a 3D CMOS technology for the SuperB Layer0 362
TID-Induced Degradation in Static and Noise Behavior of Sub-100 nm Multifinger Bulk NMOSFETs 362
First results from the characterization of a three-dimensional deep N-well MAPS prototype for vertexing applications 360
Review of radiation effects leading to noise performance degradation in 100-nm scale microelectronic technologies 354
Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors 353
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments 353
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 353
Monolithic Pixel Sensors for Fast Particle Trackers in a Quadruple Well CMOS Technology 353
MAPS with pixel level sparsified readout: from standard CMOS to vertical integration 351
Development of a multi-lead ECG wearable sensor system for biomedical applications 350
Monolithic pixel sensors for fast silicon vertex trackers in a quadruple well CMOS technology 347
Investigating Degradation Mechanisms in 130 nm and 90 nm Commercial CMOS Technologies Under Extreme Radiation Conditions 346
R&D Progress on The SuperB Silicon Vertex Tracker 346
Wearable Sensor System for Multi-lead ECG Measurement 346
Charge Signal Processors in Sparse Readout CMOS MAPS and Hybrid Pixel Sensors for the SuperB Layer0 344
Introducing 65 nm CMOS technology in low-noise read-out of semiconductor detectors 342
Recent developments on CMOS MAPS for the SuperB Silicon Vertex Tracker 341
A 4096-pixel MAPS device with on-chip data sparsification 339
Latest results of the R&D on CMOS MAPS for the Layer0 of the SuperB SVT 338
Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing 335
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 335
Beam test performance of prototype silicon detectors for the Outer Tracker for the Phase-2 Upgrade of CMS 335
Instrumentation for gate current noise measurements on sub-100 nm MOS transistors 334
Perspectives for low noise detector readout in a sub-quarter-micron CMOS SOI technology 333
Analog front-end for monolithic and hybrid pixels in a vertical integration CMOS technology 333
Review of radiation damage studies on DNW CMOS MAPS 331
TID effects in deep N-well CMOS monolithic active pixel sensors 329
CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking 328
CMOS MAPS in a homogeneous 3D process for charged particle tracking 327
65-nm CMOS Front-End Channel for Pixel Readout in the HL-LHC Radiation Environment 327
Dynamic compression of the signal in a charge sensitive amplifier: from concept to design 327
A Front-End Channel in 65 nm CMOS for Pixel Detectors at the HL-LHC Experiment Upgrades 325
Recent progress in the development of 3D deep n-well CMOS MAPS 323
Low-power clock distribution circuits for the Macro Pixel ASIC 322
A 65 nm CMOS analog processor with zero dead time for future pixel detectors 322
The associative memory for the self-triggered SLIM5 silicon telescope 321
Characterization of a large scale DNW MAPS fabricated in a 3D integration process 320
Modeling charge loss in CMOS MAPS exposed to non-ionizing radiation 318
65 nm CMOS analog front-end for pixel detectors at the HL-LHC 318
An asynchronous front-end channel for pixel detectors at the HL-LHC experiment upgrades 311
A Rad-Hard Bandgap Voltage Reference for High Energy Physics Experiments 309
The first fully functional 3D CMOS chip with Deep N-well active pixel sensors for the ILC vertex detector 307
Impact of gate-leakage current noise in sub-100 nm CMOS front-end electronics 307
Total ionizing dose effects on CMOS devices in a 110 nm technology 307
A prototype of a new generation readout ASIC in 65nm CMOS for pixel detectors at HL-LHC 306
Design of low-power, low-voltage, differential I/O links for High Energy Physics applications 303
Experimental study of different silicon sensor options for the upgrade of the CMS Outer Tracker 301
Macro Pixel ASIC (MPA): the readout ASIC for the pixel-strip (PS) module of the CMS outer tracker at HL-LHC 300
Dynamic Compression of the Signal in a Charge Sensitive Amplifier: Experimental Results 299
Ionizing Radiation Effects on the Noise of 65 nm CMOS Transistors for Pixel Sensor Readout at Extreme Total Dose Levels 297
First measurements of a prototype of a new generation pixel readout ASIC in 65 nm CMOS for extreme rate HEP detectors at HL-LHC 296
RD53 analog front-end processors for the ATLAS and CMS experiments at the high-luminosity LHC 293
Characterization of bandgap reference circuits designed for high energy physics applications 289
Design and test of clock distribution circuits for the Macro Pixel ASIC 280
Low-noise fast charge sensitive amplifier with dynamic signal compression 277
Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC 276
TID effects in deep N-well CMOS monolithic active pixel sensors 275
CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments 271
Advantages of a vertical integration process in the design of DNW MAPS 271
Deep n-well MAPS in a 130 nm CMOS technology: Beam test results 270
Novel active signal compression in low-noise analog readout at future X-ray FEL facilities 269
Totale 38.205
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Categoria #
all - tutte 149.182
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 149.182
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/20212.088 0 0 0 0 0 0 0 0 0 706 853 529
2021/20224.125 361 497 239 270 402 579 195 217 247 446 428 244
2022/20233.273 517 384 487 502 275 389 26 132 252 59 147 103
2023/20246.553 92 181 181 137 234 1.351 3.772 241 119 27 39 179
2024/20255.331 248 411 280 751 128 100 88 282 425 1.097 906 615
2025/20268.922 494 557 764 1.144 1.702 731 1.588 553 864 525 0 0
Totale 51.696