GAIONI, Luigi
 Distribuzione geografica
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Continente #
EU - Europa 25.614
NA - Nord America 9.842
AS - Asia 2.807
Continente sconosciuto - Info sul continente non disponibili 14
AF - Africa 11
SA - Sud America 9
OC - Oceania 7
Totale 38.304
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Nazione #
GB - Regno Unito 11.168
US - Stati Uniti d'America 9.561
IE - Irlanda 5.039
PL - Polonia 2.370
IT - Italia 1.846
CN - Cina 1.804
RU - Federazione Russa 1.573
DE - Germania 1.034
FR - Francia 949
SE - Svezia 797
SG - Singapore 371
UA - Ucraina 355
VN - Vietnam 299
CA - Canada 277
EU - Europa 127
FI - Finlandia 119
AT - Austria 115
KR - Corea 101
NL - Olanda 68
TR - Turchia 66
IN - India 63
ID - Indonesia 41
BE - Belgio 33
ES - Italia 29
CZ - Repubblica Ceca 27
CH - Svizzera 25
LT - Lituania 23
BG - Bulgaria 13
HK - Hong Kong 12
GR - Grecia 9
JP - Giappone 9
IR - Iran 7
AU - Australia 6
BD - Bangladesh 6
DK - Danimarca 5
LB - Libano 5
LV - Lettonia 5
SC - Seychelles 5
TW - Taiwan 5
BR - Brasile 4
IL - Israele 3
PA - Panama 3
CY - Cipro 2
HR - Croazia 2
LA - Repubblica Popolare Democratica del Laos 2
MD - Moldavia 2
MU - Mauritius 2
MZ - Mozambico 2
PE - Perù 2
PH - Filippine 2
PT - Portogallo 2
A2 - ???statistics.table.value.countryCode.A2??? 1
AM - Armenia 1
AR - Argentina 1
AZ - Azerbaigian 1
BY - Bielorussia 1
CL - Cile 1
EC - Ecuador 1
GT - Guatemala 1
HU - Ungheria 1
IQ - Iraq 1
IS - Islanda 1
KG - Kirghizistan 1
KZ - Kazakistan 1
LK - Sri Lanka 1
LU - Lussemburgo 1
MA - Marocco 1
MN - Mongolia 1
NG - Nigeria 1
NO - Norvegia 1
NZ - Nuova Zelanda 1
RO - Romania 1
TH - Thailandia 1
UZ - Uzbekistan 1
Totale 38.418
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Città #
Southend 10.810
Dublin 5.013
Warsaw 2.369
Jacksonville 1.097
Chandler 690
Woodbridge 463
Wilmington 456
Ann Arbor 447
Ashburn 432
Princeton 429
Fairfield 406
Nanjing 386
Mountain View 384
Dearborn 312
Dong Ket 298
Dalmine 285
Boardman 259
Toronto 258
Houston 241
Singapore 222
Sunnyvale 198
Beijing 194
Seattle 189
Bergamo 186
Milan 174
Shanghai 170
Rancio Valcuvia 163
Nanchang 160
Cambridge 158
Altamura 143
Atlanta 141
Andover 140
San Mateo 134
Washington 116
Vienna 111
Moscow 98
Redwood City 83
Zhengzhou 72
London 68
Tianjin 61
Kunming 60
New York 59
Ogden 56
Shenyang 54
Kiez 50
Hebei 49
Pavia 48
Fremont 43
Jakarta 41
Nürnberg 40
Jiaxing 37
Guangzhou 35
Hangzhou 34
Los Angeles 34
Kocaeli 33
Brussels 32
Norwalk 30
Jinan 27
Santa Clara 26
Amsterdam 25
Needham Heights 25
Helsinki 24
San Diego 24
Changsha 23
Chicago 23
Rome 21
Verdellino 21
Changchun 20
Frankfurt am Main 19
Hamburg 19
Lanzhou 19
Saint Petersburg 18
Brno 17
Hefei 17
Pisa 17
Westminster 17
Madrid 16
Munich 16
Hounslow 15
Sakarya 15
San Giuliano Milanese 15
Seoul 15
Vilnius 15
Istanbul 14
Lappeenranta 14
Ottawa 14
Serra 14
St Petersburg 14
Kilburn 13
Shenzhen 13
Phoenix 12
Redmond 12
Berlin 11
Duelmen 11
Falls Church 11
Geneva 11
Wuhan 11
Auburn Hills 10
Hong Kong 10
Ningbo 10
Totale 29.465
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Nome #
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 748
Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC 631
65 nm Technology for HEP: Status and Perspective 611
A prototype of pixel readout ASIC in 65 nm CMOS technology for extreme hit rate detectors at HL-LHC 554
The SuperB Silicon Vertex Tracker 498
P-Type Silicon Strip Sensors for the new CMS Tracker at HL-LHC 497
A 65 nm CMOS Front-End Chip for High Density Readout of Pixel Sensors 476
Results from CHIPIX-FE0, a small-scale prototype of a new generation pixel readout ASIC in 65 nm CMOS for HL-LHC 462
3D DNW MAPS for High Resolution, Highly Efficient, Sparse Readout CMOS Detectors 436
2D and 3D CMOS MAPS with high performance pixel-level signal processing 425
Alignment of the CMS tracker with LHC and cosmic ray data 424
Perspectives of 65nm CMOS technologies for high performance front-end electronics 420
Precision measurement of the structure of the CMS inner tracking system using nuclear interactions 416
Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications 410
Test beam demonstration of silicon microstrip modules with transverse momentum discrimination for the future CMS tracking detector 409
A 3D deep n-well CMOS MAPS for the ILC vertex detector 404
Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade 395
Design and test of a 65nm CMOS front-end with zero dead time for next generation pixel detectors 391
Beam test results for the SuperB-SVT thin striplet detector 382
Vertical integration approach to the readout of pixel detectors for vertexing applications 381
Description and performance of track and primary-vertex reconstruction with the CMS tracker 376
A 65-nm CMOS Prototype Chip With Monolithic Pixel Sensors and Fast Front-End Electronics 373
The front-end chip of the SuperB SVT detector 369
Vertically integrated deep N-well CMOS MAPS with sparsification and time stamping capabilities for thin charged particle trackers 364
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 362
The SuperB silicon vertex tracker 355
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 348
Design of bandgap reference circuits in a 65 nm CMOS technology for HL-LHC applications 343
Thin pixel development for the superB silicon vertex tracker 342
Mechanisms of Noise Degradation in Low Power 65 nm CMOS Transistors Exposed to Ionizing Radiation 334
Radiation tolerance of devices and circuits in a 3D technology based on the vertical integration of two 130-nm CMOS layers 327
Comprehensive study of total ionizing dose damage mechanisms and their effects on noise sources in a 90 nm CMOS technology 326
Forecasting noise and radiation hardness of CMOS front-end electronics beyond the 100 nm frontier 323
Fast Analog Front-end for the Readout of the SuperB SVT Inner Layers 321
Vertically integrated monolithic pixel sensors for charged particle tracking and biomedical imaging 320
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 317
First results from the characterization of a three-dimensional deep N-well MAPS prototype for vertexing applications 313
Monolithic Pixel Sensors for Fast Particle Trackers in a Quadruple Well CMOS Technology 310
Assessment of a low-power 65 nm CMOS technology for analog front-end design 309
Analog front-end for pixel sensors in a 3D CMOS technology for the SuperB Layer0 309
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments 308
Noise behavior of a 180 nm CMOS SOI technology for detector front-end electronics 306
Investigating degradation mechanisms in 130nm and 90nm commercial CMOS technologies exposed to up to 100 Mrad ionizing radiation dose 306
Introducing 65 nm CMOS technology in low-noise read-out of semiconductor detectors 301
Monolithic pixel sensors for fast silicon vertex trackers in a quadruple well CMOS technology 299
Review of radiation effects leading to noise performance degradation in 100-nm scale microelectronic technologies 294
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 294
Analog front-end for monolithic and hybrid pixels in a vertical integration CMOS technology 292
TID-Induced Degradation in Static and Noise Behavior of Sub-100 nm Multifinger Bulk NMOSFETs 292
MAPS with pixel level sparsified readout: from standard CMOS to vertical integration 289
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 289
Latest results of the R&D on CMOS MAPS for the Layer0 of the SuperB SVT 285
Perspectives for low noise detector readout in a sub-quarter-micron CMOS SOI technology 284
Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing 284
Recent progress in the development of 3D deep n-well CMOS MAPS 283
Low-power clock distribution circuits for the Macro Pixel ASIC 280
CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking 280
A 4096-pixel MAPS device with on-chip data sparsification 280
Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors 277
Charge Signal Processors in Sparse Readout CMOS MAPS and Hybrid Pixel Sensors for the SuperB Layer0 276
Recent developments on CMOS MAPS for the SuperB Silicon Vertex Tracker 275
R&D Progress on The SuperB Silicon Vertex Tracker 274
Development of a multi-lead ECG wearable sensor system for biomedical applications 270
Beam test performance of prototype silicon detectors for the Outer Tracker for the Phase-2 Upgrade of CMS 268
Investigating Degradation Mechanisms in 130 nm and 90 nm Commercial CMOS Technologies Under Extreme Radiation Conditions 267
Wearable Sensor System for Multi-lead ECG Measurement 267
Characterization of a large scale DNW MAPS fabricated in a 3D integration process 264
Review of radiation damage studies on DNW CMOS MAPS 263
TID effects in deep N-well CMOS monolithic active pixel sensors 261
Design of low-power, low-voltage, differential I/O links for High Energy Physics applications 261
Impact of gate-leakage current noise in sub-100 nm CMOS front-end electronics 260
65 nm CMOS analog front-end for pixel detectors at the HL-LHC 259
The first fully functional 3D CMOS chip with Deep N-well active pixel sensors for the ILC vertex detector 257
A Front-End Channel in 65 nm CMOS for Pixel Detectors at the HL-LHC Experiment Upgrades 257
Instrumentation for gate current noise measurements on sub-100 nm MOS transistors 256
Modeling charge loss in CMOS MAPS exposed to non-ionizing radiation 253
65-nm CMOS Front-End Channel for Pixel Readout in the HL-LHC Radiation Environment 252
First measurements of a prototype of a new generation pixel readout ASIC in 65 nm CMOS for extreme rate HEP detectors at HL-LHC 251
Total ionizing dose effects on CMOS devices in a 110 nm technology 250
Dynamic compression of the signal in a charge sensitive amplifier: from concept to design 249
A prototype of a new generation readout ASIC in 65nm CMOS for pixel detectors at HL-LHC 248
CMOS MAPS in a homogeneous 3D process for charged particle tracking 247
Macro Pixel ASIC (MPA): the readout ASIC for the pixel-strip (PS) module of the CMS outer tracker at HL-LHC 247
Ionizing Radiation Effects on the Noise of 65 nm CMOS Transistors for Pixel Sensor Readout at Extreme Total Dose Levels 244
The associative memory for the self-triggered SLIM5 silicon telescope 243
Experimental study of different silicon sensor options for the upgrade of the CMS Outer Tracker 239
An asynchronous front-end channel for pixel detectors at the HL-LHC experiment upgrades 238
A 65 nm CMOS analog processor with zero dead time for future pixel detectors 237
Dynamic Compression of the Signal in a Charge Sensitive Amplifier: Experimental Results 232
TID effects in deep N-well CMOS monolithic active pixel sensors 229
Design of a monolithic active pixel sensor in a two-layer 3D CMOS technology 226
Deep n-well MAPS in a 130 nm CMOS technology: Beam test results 223
Design and test of clock distribution circuits for the Macro Pixel ASIC 221
Low-noise fast charge sensitive amplifier with dynamic signal compression 220
CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments 218
Characterization of bandgap reference circuits designed for high energy physics applications 216
Development of a triple well CMOS MAPS device with in-pixel signal processing and sparsified readout capabilities 215
Development of deep N-well MAPS in a 130 nm CMOS technology and beam test results on a 4k-Pixel matrix with digital sparsified readout 213
A Rad-Hard Bandgap Voltage Reference for High Energy Physics Experiments 212
RD53 analog front-end processors for the ATLAS and CMS experiments at the high-luminosity LHC 210
Totale 31.702
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Categoria #
all - tutte 106.271
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 106.271
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/20201.852 0 0 0 0 0 281 427 191 401 164 170 218
2020/20216.478 586 337 369 401 468 574 766 225 664 706 853 529
2021/20224.125 361 497 239 270 402 579 195 217 247 446 428 244
2022/20233.273 517 384 487 502 275 389 26 132 252 59 147 103
2023/20246.553 92 181 181 137 234 1.351 3.772 241 119 27 39 179
2024/20251.909 248 411 280 751 128 91 0 0 0 0 0 0
Totale 39.352