MANGHISONI, Massimo
 Distribuzione geografica
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Continente #
EU - Europa 38.195
NA - Nord America 14.783
AS - Asia 3.814
Continente sconosciuto - Info sul continente non disponibili 23
AF - Africa 17
SA - Sud America 11
OC - Oceania 5
Totale 56.848
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Nazione #
GB - Regno Unito 18.445
US - Stati Uniti d'America 13.861
IE - Irlanda 7.856
CN - Cina 2.797
IT - Italia 2.786
PL - Polonia 2.180
DE - Germania 1.927
FR - Francia 1.397
SE - Svezia 1.261
RU - Federazione Russa 1.068
CA - Canada 920
UA - Ucraina 570
VN - Vietnam 439
AT - Austria 215
EU - Europa 161
FI - Finlandia 160
KR - Corea 149
SG - Singapore 148
IN - India 128
NL - Olanda 113
TR - Turchia 76
CH - Svizzera 55
BE - Belgio 49
ES - Italia 33
JP - Giappone 22
LT - Lituania 21
BG - Bulgaria 14
IR - Iran 14
RO - Romania 11
HK - Hong Kong 9
BR - Brasile 8
BD - Bangladesh 6
LV - Lettonia 6
PT - Portogallo 6
AU - Australia 5
DK - Danimarca 5
GR - Grecia 5
LB - Libano 5
CZ - Repubblica Ceca 4
IL - Israele 4
SC - Seychelles 4
TW - Taiwan 4
BJ - Benin 3
BY - Bielorussia 3
DZ - Algeria 3
MD - Moldavia 3
A2 - ???statistics.table.value.countryCode.A2??? 2
IQ - Iraq 2
MU - Mauritius 2
MY - Malesia 2
MZ - Mozambico 2
PH - Filippine 2
UZ - Uzbekistan 2
VE - Venezuela 2
A1 - Anonimo 1
CY - Cipro 1
ET - Etiopia 1
GN - Guinea 1
GT - Guatemala 1
HU - Ungheria 1
KZ - Kazakistan 1
MN - Mongolia 1
MX - Messico 1
NG - Nigeria 1
NO - Norvegia 1
PE - Perù 1
SY - Repubblica araba siriana 1
TH - Thailandia 1
Totale 56.989
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Città #
Southend 17.405
Dublin 7.810
Warsaw 2.178
Jacksonville 1.748
Chandler 1.121
Ann Arbor 722
Princeton 668
Nanjing 634
Wilmington 550
Mountain View 544
Ashburn 532
Montréal 510
Dearborn 505
Woodbridge 484
Munich 449
Dong Ket 434
Dalmine 418
Toronto 395
Mcallen 362
Beijing 358
Fairfield 357
Houston 270
Nanchang 255
Milan 247
Sunnyvale 235
Atlanta 231
Altamura 230
Bergamo 226
Washington 221
Andover 218
San Mateo 215
Vienna 205
Rancio Valcuvia 182
Shanghai 180
Seattle 167
Boardman 158
Zhengzhou 135
Cambridge 133
Redwood City 120
Kunming 111
Ogden 96
New York 92
London 91
Tianjin 84
Kiez 83
Shenyang 81
Hebei 79
Fremont 66
Pavia 62
Nürnberg 60
Hangzhou 58
Jiaxing 57
Guangzhou 55
Needham Heights 54
Brussels 47
Kocaeli 43
Norwalk 43
Changsha 41
Saint Petersburg 39
Changchun 35
Jinan 34
Lanzhou 33
Sakarya 30
Rome 29
Verdellino 29
Amsterdam 27
Segrate 25
San Diego 24
Hounslow 22
Westminster 22
Seoul 21
Vilnius 21
Hefei 20
Kilburn 20
Ningbo 20
Madrid 19
Acton 18
Frankfurt am Main 17
Pisa 17
Serra 17
Auburn Hills 16
Tappahannock 16
Redmond 15
Verona 15
Azzano Decimo 14
Falls Church 14
Islington 14
St Petersburg 14
Duelmen 13
Helsinki 13
Santa Clara 13
Carignano 12
Chiswick 12
Fuzhou 12
Geneva 12
Los Angeles 12
Philadelphia 12
Angera 10
Lappeenranta 10
New Bedfont 10
Totale 43.913
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Nome #
PixFEL: Enabling technologies, building blocks and architectures for advanced X-ray pixel cameras at the next generation FELs 2.003
0.13μm CMOS technologies for analog front-end circuits in LHC detector upgrades 768
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 732
130 nm and 90 nm CMOS Technologies for Detector Front-end Applications 687
Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC 616
65 nm Technology for HEP: Status and Perspective 601
The SuperB Silicon Vertex Tracker 478
P-Type Silicon Strip Sensors for the new CMS Tracker at HL-LHC 477
A 65 nm CMOS Front-End Chip for High Density Readout of Pixel Sensors 460
A 10 bit resolution readout channel with dynamic range compression for X-ray imaging at FELs 445
3D DNW MAPS for High Resolution, Highly Efficient, Sparse Readout CMOS Detectors 419
2D and 3D CMOS MAPS with high performance pixel-level signal processing 413
Perspectives of 65nm CMOS technologies for high performance front-end electronics 411
Alignment of the CMS tracker with LHC and cosmic ray data 400
Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications 399
Test beam demonstration of silicon microstrip modules with transverse momentum discrimination for the future CMS tracking detector 393
Precision measurement of the structure of the CMS inner tracking system using nuclear interactions 393
A 3D deep n-well CMOS MAPS for the ILC vertex detector 387
Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade 382
Monolithic pixel detectors in a 0.13 µm CMOS technology with sensor level continuous time charge amplification and shaping 375
Vertical integration approach to the readout of pixel detectors for vertexing applications 373
Description and performance of track and primary-vertex reconstruction with the CMS tracker 368
Beam test results for the SuperB-SVT thin striplet detector 367
A 65-nm CMOS Prototype Chip With Monolithic Pixel Sensors and Fast Front-End Electronics 362
Development of the DEPFET Sensor With Signal Compression: A Large Format X-Ray Imager With Mega-Frame Readout Capability for the European XFEL 357
The front-end chip of the SuperB SVT detector 350
Performance of a high accuracy injection circuit for in-pixel calibration of a large sensor matrix 349
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 349
The SuperB silicon vertex tracker 348
Vertically integrated deep N-well CMOS MAPS with sparsification and time stamping capabilities for thin charged particle trackers 348
The DSSC Pixel Readout ASIC with Amplitude Digitization and Local Storage for DEPFET Sensor Matrices at the European XFEL 341
Impact of lateral isolation oxides on radiation-induced noise degradation in CMOS technologies in the 100-nm regime 336
A new approach to the design of monolithic active pixel detectors in 0.13 µm triple well CMOS technology 336
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 334
Thin pixel development for the superB silicon vertex tracker 332
Design of bandgap reference circuits in a 65 nm CMOS technology for HL-LHC applications 331
Noise performance of 0.13 µm CMOS technologies for detector front-end applications 331
Mechanisms of Noise Degradation in Low Power 65 nm CMOS Transistors Exposed to Ionizing Radiation 319
Monolithic Active Pixel Sensors for the vertex detector at the International Linear Collider 315
The PixFEL project: development of advanced X-ray pixel detectors for application at future FEL facilities 312
Vertically integrated monolithic pixel sensors for charged particle tracking and biomedical imaging 311
Comprehensive study of total ionizing dose damage mechanisms and their effects on noise sources in a 90 nm CMOS technology 311
Radiation tolerance of devices and circuits in a 3D technology based on the vertical integration of two 130-nm CMOS layers 311
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 309
Fast Analog Front-end for the Readout of the SuperB SVT Inner Layers 307
Forecasting noise and radiation hardness of CMOS front-end electronics beyond the 100 nm frontier 307
Total ionizing dose effects on the noise performances of a 0.13 /spl mu/m CMOS technology 303
First results from the characterization of a three-dimensional deep N-well MAPS prototype for vertexing applications 303
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments 300
Response of SOI bipolar transistors exposed to gamma-rays under different dose rate and bias conditions 299
Gamma-ray response of SOI bipolar junction transistors for fast, radiation tolerant front-end electronics 298
FSSR2, a self-triggered low noise readout chip for silicon strip detectors 298
Front-end performance and charge collection properties of heavily irradiated DNW MAPS 298
Investigating degradation mechanisms in 130nm and 90nm commercial CMOS technologies exposed to up to 100 Mrad ionizing radiation dose 298
Noise behavior of a 180 nm CMOS SOI technology for detector front-end electronics 297
A novel monolithic active pixel detector in a 0.13 µm triple well CMOS technology with pixel level analog processing 297
Survey of noise performances and scaling effects in deep submicrometer CMOS devices from different foundries 296
High accuracy injection circuit for the calibration of a large pixel sensor matrix 296
Recent results from the development of silicon detectors with integrated electronics 295
Pixel-Level charge and current injection circuit for high accuracy calibration of the DSSC Chip at the European XFEL 295
Introducing 65 nm CMOS technology in low-noise read-out of semiconductor detectors 294
High precision injection circuit for in-pixel calibration of a large sensor matrix 288
TID-Induced Degradation in Static and Noise Behavior of Sub-100 nm Multifinger Bulk NMOSFETs 287
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 287
Gate Current Noise in Ultrathin Oxide MOSFETs and Its Impact on the Performance of Analog Front-End Circuits 286
Review of radiation effects leading to noise performance degradation in 100-nm scale microelectronic technologies 286
First prototype of a silicon microstrip detector with the data-driven readout chip FSSR2 for a tracking-based trigger system 285
A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion 285
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 284
The readout of the LHC beam luminosity monitor: accurate shower energy measurements at a 40 MHz repetition rate 282
Fermilab silicon strip readout chip for BTeV 282
Assessment of a low-power 65 nm CMOS technology for analog front-end design 281
Design criteria for low noise front-end electronics in the 0.13 µm CMOS generation 280
MAPS with pixel level sparsified readout: from standard CMOS to vertical integration 279
Perspectives for low noise detector readout in a sub-quarter-micron CMOS SOI technology 276
Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing 276
CMOS MAPS with fully integrated, hybrid-pixel-like analog front-end electronics 275
Recent progress in the development of 3D deep n-well CMOS MAPS 274
CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking 274
Performance of a DNW CMOS active pixel sensor designed for the ILC Vertex Detector 273
Low-power clock distribution circuits for the Macro Pixel ASIC 273
Design and Performance of Analog Circuits for DNW-MAPS in 100-nm-scale CMOS Technology 273
A 4096-pixel MAPS device with on-chip data sparsification 272
Latest results of the R&D on CMOS MAPS for the Layer0 of the SuperB SVT 272
Proton-induced damage in JFET transistors and charge preamplifiers on high-resistivity silicon 271
Pixel-Level Continuous-Time Analog Signal Processing for 130 nm CMOS MAPS 271
Deep N-well CMOS MAPS with in-pixel signal processing and sparsification for the ILC vertex detector 271
A pixelated x-ray detector for diffraction imaging at next-generation high-rate FEL sources 269
Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors 268
Noise analysis of NPN SOI bipolar transistors for the design of charge measuring systems 268
Charge Signal Processors in Sparse Readout CMOS MAPS and Hybrid Pixel Sensors for the SuperB Layer0 266
Resolution limits in 130 nm and 90 nm CMOS technologies for analog front-end applications 265
Recent developments on CMOS MAPS for the SuperB Silicon Vertex Tracker 264
FSSR2, a self-triggered low noise readout chip for silicon strip detectors 263
R&D Progress on The SuperB Silicon Vertex Tracker 263
Investigating Degradation Mechanisms in 130 nm and 90 nm Commercial CMOS Technologies Under Extreme Radiation Conditions 260
Minimum noise design of charge amplifiers with CMOS processes in the 100 nm feature size range 259
Low noise design issues for analog front-end electronics in 130 nm and 90 nm CMOS technologies 258
Design and performance of a DNW CMOS Active Pixel Sensor for the ILC vertex detector 256
Design of low-power, low-voltage, differential I/O links for High Energy Physics applications 256
Totale 35.078
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Categoria #
all - tutte 138.898
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 138.898
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/20191.547 0 0 0 0 0 0 0 0 0 0 1.007 540
2019/20206.245 935 256 809 755 533 442 675 298 669 260 267 346
2020/20219.465 905 558 485 563 613 840 1.053 307 1.008 1.027 1.321 785
2021/20226.425 545 794 357 428 621 946 290 309 385 710 665 375
2022/20235.169 811 595 784 758 442 653 67 213 367 99 228 152
2023/20249.792 133 242 287 204 330 2.118 5.892 345 189 46 6 0
Totale 58.422