TRAVERSI, Gianluca
 Distribuzione geografica
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Continente #
EU - Europa 38.950
NA - Nord America 15.254
AS - Asia 3.902
Continente sconosciuto - Info sul continente non disponibili 24
AF - Africa 21
SA - Sud America 12
OC - Oceania 10
Totale 58.173
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Nazione #
GB - Regno Unito 18.635
US - Stati Uniti d'America 14.314
IE - Irlanda 7.765
CN - Cina 2.852
IT - Italia 2.813
PL - Polonia 2.689
DE - Germania 1.931
FR - Francia 1.449
SE - Svezia 1.292
RU - Federazione Russa 1.042
CA - Canada 938
UA - Ucraina 570
VN - Vietnam 471
AT - Austria 268
FI - Finlandia 166
EU - Europa 155
KR - Corea 150
SG - Singapore 150
IN - India 131
NL - Olanda 108
TR - Turchia 76
BE - Belgio 55
CH - Svizzera 47
ES - Italia 37
LT - Lituania 21
JP - Giappone 17
BG - Bulgaria 15
IR - Iran 12
RO - Romania 11
AU - Australia 10
BR - Brasile 9
GR - Grecia 7
SC - Seychelles 7
BD - Bangladesh 6
HK - Hong Kong 6
LV - Lettonia 6
PT - Portogallo 6
TW - Taiwan 6
DK - Danimarca 5
LB - Libano 5
CZ - Repubblica Ceca 4
DZ - Algeria 4
IL - Israele 4
BJ - Benin 3
MD - Moldavia 3
MN - Mongolia 3
A2 - ???statistics.table.value.countryCode.A2??? 2
BY - Bielorussia 2
IQ - Iraq 2
KZ - Kazakistan 2
MU - Mauritius 2
MY - Malesia 2
MZ - Mozambico 2
PH - Filippine 2
UZ - Uzbekistan 2
VE - Venezuela 2
A1 - Anonimo 1
CY - Cipro 1
ET - Etiopia 1
GN - Guinea 1
GT - Guatemala 1
HU - Ungheria 1
LU - Lussemburgo 1
MX - Messico 1
NG - Nigeria 1
NO - Norvegia 1
PE - Perù 1
SY - Repubblica araba siriana 1
TH - Thailandia 1
Totale 58.307
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Città #
Southend 17.591
Dublin 7.717
Warsaw 2.688
Jacksonville 1.791
Chandler 1.158
Ann Arbor 787
Princeton 674
Nanjing 642
Wilmington 590
Mountain View 549
Woodbridge 542
Ashburn 541
Dearborn 515
Montréal 510
Dong Ket 466
Fairfield 460
Munich 446
Toronto 410
Dalmine 379
Beijing 362
Mcallen 362
Houston 305
Milan 265
Vienna 259
Bergamo 255
Nanchang 247
Sunnyvale 239
Altamura 237
Atlanta 235
San Mateo 221
Andover 214
Rancio Valcuvia 211
Washington 205
Seattle 197
Shanghai 174
Cambridge 170
Boardman 156
Zhengzhou 151
Redwood City 122
Kunming 110
London 100
Tianjin 98
Ogden 97
Shenyang 88
Kiez 86
Hebei 83
New York 76
Fremont 62
Jiaxing 59
Nürnberg 56
Pavia 56
Guangzhou 55
Brussels 53
Needham Heights 51
Hangzhou 49
Norwalk 42
Kocaeli 40
Jinan 38
Changsha 37
Saint Petersburg 35
Changchun 34
Sakarya 33
Amsterdam 29
Lanzhou 29
San Diego 29
Westminster 25
Segrate 24
Ningbo 23
Rome 22
Auburn Hills 21
Hounslow 21
Madrid 21
Pisa 21
Verdellino 21
Vilnius 21
Hefei 20
Kilburn 18
Seoul 18
Acton 17
Frankfurt am Main 17
Serra 17
Duelmen 16
Helsinki 16
St Petersburg 16
Los Angeles 15
Ratingen 15
San Giuliano Milanese 15
Wuhan 15
Falls Church 14
Islington 14
Verona 14
Azzano Decimo 13
Chiswick 13
Ottawa 13
Phoenix 13
Redmond 13
Tappahannock 13
Bottrop 12
New Bedfont 12
Philadelphia 12
Totale 45.159
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Nome #
PixFEL: Enabling technologies, building blocks and architectures for advanced X-ray pixel cameras at the next generation FELs 2.003
0.13μm CMOS technologies for analog front-end circuits in LHC detector upgrades 768
A 3D Vertically Integrated Deep N-Well CMOS MAPS for the SuperB Layer0 732
130 nm and 90 nm CMOS Technologies for Detector Front-end Applications 687
Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC 616
65 nm Technology for HEP: Status and Perspective 601
A prototype of pixel readout ASIC in 65 nm CMOS technology for extreme hit rate detectors at HL-LHC 537
The SuperB Silicon Vertex Tracker 478
P-Type Silicon Strip Sensors for the new CMS Tracker at HL-LHC 477
Transmission lines implementation on HDI flex circuits for the CMS tracker upgrade 461
A 65 nm CMOS Front-End Chip for High Density Readout of Pixel Sensors 460
Results from CHIPIX-FE0, a small-scale prototype of a new generation pixel readout ASIC in 65 nm CMOS for HL-LHC 449
A 10 bit resolution readout channel with dynamic range compression for X-ray imaging at FELs 445
3D DNW MAPS for High Resolution, Highly Efficient, Sparse Readout CMOS Detectors 419
2D and 3D CMOS MAPS with high performance pixel-level signal processing 413
Perspectives of 65nm CMOS technologies for high performance front-end electronics 411
Alignment of the CMS tracker with LHC and cosmic ray data 400
Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications 399
Test beam demonstration of silicon microstrip modules with transverse momentum discrimination for the future CMS tracking detector 393
Precision measurement of the structure of the CMS inner tracking system using nuclear interactions 393
A 3D deep n-well CMOS MAPS for the ILC vertex detector 387
Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade 382
Monolithic pixel detectors in a 0.13 µm CMOS technology with sensor level continuous time charge amplification and shaping 375
Vertical integration approach to the readout of pixel detectors for vertexing applications 373
Description and performance of track and primary-vertex reconstruction with the CMS tracker 368
Beam test results for the SuperB-SVT thin striplet detector 367
A 65-nm CMOS Prototype Chip With Monolithic Pixel Sensors and Fast Front-End Electronics 362
The front-end chip of the SuperB SVT detector 350
Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker 349
The SuperB silicon vertex tracker 348
Vertically integrated deep N-well CMOS MAPS with sparsification and time stamping capabilities for thin charged particle trackers 348
Impact of lateral isolation oxides on radiation-induced noise degradation in CMOS technologies in the 100-nm regime 336
A new approach to the design of monolithic active pixel detectors in 0.13 µm triple well CMOS technology 336
2D and 3D thin pixel technologies for the Layer0 of the SuperB Silicon Vertex Tracker 334
Thin pixel development for the superB silicon vertex tracker 332
Design of bandgap reference circuits in a 65 nm CMOS technology for HL-LHC applications 331
Noise performance of 0.13 µm CMOS technologies for detector front-end applications 331
Mechanisms of Noise Degradation in Low Power 65 nm CMOS Transistors Exposed to Ionizing Radiation 319
Monolithic Active Pixel Sensors for the vertex detector at the International Linear Collider 315
The PixFEL project: development of advanced X-ray pixel detectors for application at future FEL facilities 312
Vertically integrated monolithic pixel sensors for charged particle tracking and biomedical imaging 311
Comprehensive study of total ionizing dose damage mechanisms and their effects on noise sources in a 90 nm CMOS technology 311
Radiation tolerance of devices and circuits in a 3D technology based on the vertical integration of two 130-nm CMOS layers 311
The Apsel65 front-end chip for the readout of pixel sensors in the 65 nm CMOS node 309
Fast Analog Front-end for the Readout of the SuperB SVT Inner Layers 307
Forecasting noise and radiation hardness of CMOS front-end electronics beyond the 100 nm frontier 307
Monolithic Pixel Sensors for Fast Particle Trackers in a Quadruple Well CMOS Technology 304
Total ionizing dose effects on the noise performances of a 0.13 /spl mu/m CMOS technology 303
First results from the characterization of a three-dimensional deep N-well MAPS prototype for vertexing applications 303
CMOS technologies in the 100 nm range for rad-hard front-end electronics in future collider experiments 300
Response of SOI bipolar transistors exposed to gamma-rays under different dose rate and bias conditions 299
Analog front-end for pixel sensors in a 3D CMOS technology for the SuperB Layer0 298
Gamma-ray response of SOI bipolar junction transistors for fast, radiation tolerant front-end electronics 298
Front-end performance and charge collection properties of heavily irradiated DNW MAPS 298
Investigating degradation mechanisms in 130nm and 90nm commercial CMOS technologies exposed to up to 100 Mrad ionizing radiation dose 298
Noise behavior of a 180 nm CMOS SOI technology for detector front-end electronics 297
A novel monolithic active pixel detector in a 0.13 µm triple well CMOS technology with pixel level analog processing 297
Survey of noise performances and scaling effects in deep submicrometer CMOS devices from different foundries 296
Recent results from the development of silicon detectors with integrated electronics 295
Introducing 65 nm CMOS technology in low-noise read-out of semiconductor detectors 294
Charge signal processors in a 130 nm CMOS technology for the sparse readout of small pitch monolithic and hybrid pixel sensors 293
Monolithic pixel sensors for fast silicon vertex trackers in a quadruple well CMOS technology 292
TID-Induced Degradation in Static and Noise Behavior of Sub-100 nm Multifinger Bulk NMOSFETs 287
Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology 287
Review of radiation effects leading to noise performance degradation in 100-nm scale microelectronic technologies 286
Analog front-end for monolithic and hybrid pixels in a vertical integration CMOS technology 285
A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion 285
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 284
The readout of the LHC beam luminosity monitor: accurate shower energy measurements at a 40 MHz repetition rate 282
A 65 nm Rad-Hard Bandgap Voltage Reference for LHC Environment 282
Assessment of a low-power 65 nm CMOS technology for analog front-end design 281
Design criteria for low noise front-end electronics in the 0.13 µm CMOS generation 280
MAPS with pixel level sparsified readout: from standard CMOS to vertical integration 279
Perspectives for low noise detector readout in a sub-quarter-micron CMOS SOI technology 276
Beam test results of different configurations of deep N-well MAPS matrices featuring in pixel full signal processing 276
CMOS MAPS with fully integrated, hybrid-pixel-like analog front-end electronics 275
Recent progress in the development of 3D deep n-well CMOS MAPS 274
CMOS MAPS in a Homogeneous 3D Process for Charged Particle Tracking 274
Performance of a DNW CMOS active pixel sensor designed for the ILC Vertex Detector 273
Low-power clock distribution circuits for the Macro Pixel ASIC 273
Design and Performance of Analog Circuits for DNW-MAPS in 100-nm-scale CMOS Technology 273
A 4096-pixel MAPS device with on-chip data sparsification 272
Latest results of the R&D on CMOS MAPS for the Layer0 of the SuperB SVT 272
Proton-induced damage in JFET transistors and charge preamplifiers on high-resistivity silicon 271
Pixel-Level Continuous-Time Analog Signal Processing for 130 nm CMOS MAPS 271
Deep N-well CMOS MAPS with in-pixel signal processing and sparsification for the ILC vertex detector 271
Characterization of bulk damage in CMOS MAPS with Deep N-Well collecting electrode 269
A pixelated x-ray detector for diffraction imaging at next-generation high-rate FEL sources 269
Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors 268
Noise analysis of NPN SOI bipolar transistors for the design of charge measuring systems 268
Charge Signal Processors in Sparse Readout CMOS MAPS and Hybrid Pixel Sensors for the SuperB Layer0 266
Resolution limits in 130 nm and 90 nm CMOS technologies for analog front-end applications 265
Recent developments on CMOS MAPS for the SuperB Silicon Vertex Tracker 264
R&D Progress on The SuperB Silicon Vertex Tracker 263
Investigating Degradation Mechanisms in 130 nm and 90 nm Commercial CMOS Technologies Under Extreme Radiation Conditions 260
Minimum noise design of charge amplifiers with CMOS processes in the 100 nm feature size range 259
A quadruple well CMOS MAPS prototype for the Layer0 of the SuperB SVT 258
Recent results and plans of the 3D IC consortium 258
Low noise design issues for analog front-end electronics in 130 nm and 90 nm CMOS technologies 258
Design and performance of a DNW CMOS Active Pixel Sensor for the ILC vertex detector 256
Totale 35.468
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Categoria #
all - tutte 139.287
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 139.287
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/20191.615 0 0 0 0 0 0 0 0 0 0 1.047 568
2019/20206.585 948 279 839 853 558 463 712 317 688 275 292 361
2020/202110.006 947 574 549 636 695 856 1.104 320 1.045 1.072 1.361 847
2021/20226.594 560 831 388 441 635 969 300 310 395 724 676 365
2022/20235.255 830 616 789 782 453 635 44 230 392 103 231 150
2023/20249.660 136 259 260 215 340 2.056 5.804 351 178 55 6 0
Totale 59.727